SMT is surface mount technology (short for Surface Mount Technology) and is currently the most popular technology and process in the electronics assembly industry.

SMT includes surface mount technology, surface mount equipment, surface mount components, and SMT management. Features: high assembly density, small size and light weight of electronic products. The size and weight of patch components are only about 1/10 of that of traditional plug-in components. After SMT is generally used, the volume of electronic products is reduced by 40%~60%, and the weight is reduced by 60%. %~80%. High reliability and strong anti-vibration ability. The solder joint defect rate is low. High frequency characteristics are good. Reduced electromagnetic and radio frequency interference. Easy to automate and increase productivity. Reduce costs by 30% to 50%. Save materials, energy, equipment, manpower, time, etc.

At present, the positioning of packaging technology has gradually evolved from general production technologies such as connection and assembly to a key technology for achieving highly diverse electronic information equipment. Higher density, smaller bumps, lead-free processes, etc. require new packaging technologies that are more adaptable to the rapidly changing needs of the consumer electronics market. The innovation of packaging technology has also become a powerful driving force for the continued development of semiconductor and electronic manufacturing technology, and has a significant impact on the improvement of semiconductor front-end technology and surface mount technology. If flip chip bump generation is an extension of the semiconductor front-end process to the back-end package, then silicon bond bump generation based on wire bonding is an extension of the packaging process.